LTE Device Chipsets: The Workhorses of LTE - In-Stat Report

LTE Device Chipsets: The Workhorses of LTE
In-Stat Report
April 8, 2010

The challenges in LTE silicon are many, and many of the complications in LTE deployment are revealed in the benefits. As LTE platforms are expected to support many different airlinks, so too will the end-use devices. Mobile phones will be expected to seamlessly transition from 3G networks to the LTE platform and vice-versa.

This report starts with an overview of LTE chipset architecture and the LTE ecosystem. The report then reviews the LTE chipset vendors including Altair Semiconductor, BitWave Semiconductor, ComSys Mobile, Qualcomm, and Samsung. Then, by defining the protocols, understanding the LTE ecosystem, and reviewing what we know about the LTE chipset manufacturers at this moment, we can anticipate which devices will enter the market. The last section of the report reviews the integration of LTE chipsets into mobile handsets.

The report includes market estimates and forecasts of LTE USB dongles and external clients, total portable devices, handset regional shipments, silicon BOM, and silicon revenue. Also included are the estimates for LTE MAC software and IP royalties.

Executive Summary:
LTE Chipset Makers Position for Long Term Endeavor
LTE is a great and truly evolutionary communications platform and LTE will become the dominant 4G technology. However, deployment of LTE will be gradual and protracted. Nevertheless, chipset manufacturers, such as Broadcom, Infineon and Qualcomm, have established LTE product development plans, according to market research firm In-Stat. Further, market entrants, including companies such as Altair Semiconductor, Beceem, BitWave, Comsys, Sequans and Wavesat, are hoping the shift to LTE opens new opportunity.

Leading 3G baseband chipsets providers will not necessarily keep their leadership in LTE, says Allen Nogee, In-Stat analyst. The changes in platforms and technologies are disruptive enough to create major competitive shifts.

Recent research by In-Stat found the following:
·    By 2013, the total value of global end-use device silicon will exceed US$2 billion, but still be early in the growth cycle.
·    Much of the success in silicon will be made in low-noise amplifiers, power amplification, analog-to-digital conversion, SAW filters, and battery-life.
·    LTE RF solutions will have to have transceiver diversity because many different channel spectra will have to be supported. Most devices entering the LTE market will be dual-mode.
·    The LTE-dedicated silicon BOM for mobile handsets will be slightly over US$125 in 2011 and decline by nearly 30% by 2013.

Recent In-Stat research, LTE Device Chipsets: The Workhorses of LTE (#IN1004522WBB), covers the worldwide market for LTE silicon. It includes:
·    Examination of LTE end-use device architecture.
·    Analysis of the LTE ecosystem.
·    Overview of the LTE end-user chipset vendor landscape.
·    Forecasts (20102013) for Total Value of LTE USB Dongle and ExternalClientsSilicon; LTE Portable End-Devices Shipments, Excluding Handsets; and LTE Embedded Chipset Silicon Bill of Materials in Portable End-Devices, Excluding Handsets.

Key Topics Covered:
·    Executive Summary
·    LTE End-Use Device Architecture Overview
·    PHYOFDM
·    Basic Protocol Layers in an LTE End-Use Device
·    RF Transceiver
·    LTE PHY
·    LTE MAC
·    Radio Link Control
·    Packet Data Control Protocol
·    Radio Resource Control
·    The Mobility Management Entity
·    LTE Ecosystem
·    Major Mobile Operators Determine how Quickly LTE is Widely Deployed
·    LTE Patent and Royalty Pool
·    Recent Developments within the LTSI (The LTE/SAE Trial Initiative)
·    About LTE and LTE Advanced
·    Moving From First-Generation LTE Chipsets to Next-Generation LTE Chipsets
·    LTE End-Use Chipset Vendor Landscape
·    The Samsung GT-B3710, the First Batter Up
·    LTE USB Dongles and External Devices
·    LTE Embedded Chipsets (Excluding Mobile Handsets)
·    Challenges to Building an LTE Chipset for Mobile Handsets
·    Discrete Applications Processors
·    Time-to-Market
·    Antenna Technology
·    Regional Handset Shipments
·    Roll-Up Charts and Non-Silicon Costs
·    Non-Silicon Costs in LTE Devices
·    List of Tables
·    List of Figures

Companies Mentioned:
·    Altair Semiconductor
·    BitWave Semiconductor
·    Comsys Mobile
·    Infineon
·    Qualcomm
·    Samsung
·    ST-Ericsson
·    Wavesat

For more information visit http://www.researchandmarkets.com/research/48ea4e/lte_device_chipset