In the news

By Martin Rowe.

If you design wireless IoT devices, you focus on connectivity, battery life, and cost. While many IoT devices connect to LTE networks, LTE isn’t everywhere.

By IoT Design Pro.

Soracom has announced the completion of Proof of Concept (PoC) that demonstrates integrated SIM (iSIM) capability designed to support the next generation of IoT devices. 

By Claire Swedberg, RFID Journal.

AT&T and Sony have teamed up to provide a solution to Bayer’s Crops Science Division consisting of an adhesive, disposable IoT label that transmits its identity and sensor data via a cellular network for a view into seeds and other goods moving through an international supply chain.

By AT&T.

Internet of Things Solution to Help Bring Full Visibility to Products Shipped Worldwide and Help Transform the Global Supply Chain Across Industries.

By Murata.

In conjunction with Sony Semiconductor Israel (Sony, formerly Altair Semiconductor), STMicroelectronics, and Truphone, Murata today introduced the availability of the Type 1SE module.

By Telit.

The NE310L2 features best-in-class power consumption, optional 2G fallback, an ultra-compact footprint, and future integrated SIM support

By IoT For All.

Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets, announced the launch of the Altair ALT1255, a new low-power NB2 chipset.

By everything RF.

Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets, announced the launch of the Altair ALT1255, a new low-power NB2 chipset.

By Jean-Luc Aufranc, CNX Software.

Sony Semiconductor Israel, previously known as Altair Semiconductor, has announced the launch of the Altair ALT1255 NB-IoT (NB2) chipset. 

By Maurizio Di Paolo Emilio, EE Times Europe.

As IoT expands to include all types of connected “things”, many companies are providing several low power and connectivity chips to support the millions of devices.